TEMPO.CO, Jakarta - Samsung planned to make chips with 3 nanometers (nm) process technology in 2022 as it is stated on Phone Arena’s website on May 27, 2018.
This giant smartphone that came from Korea will construct the chip using Gate-All-Around (GAA), multi-bridge-channel FET (MBCFET). The chipset is small-sized and will be produced with strong process and energy conservative.
The plan was conveyed by Samsung in the annual Foundry Forum in America last week. On the event, Samsung unveiled the roadmap to produce the chipsets. It starts with the process technology of 7 nm Low Power Plus, 5 nm Low Power Early and 3nm Gate-All-Around Early.
The 7 nm chip will be produced this year with lithography EUV solution. Mass production of parts using the new process will begin in the first half of 2019. It will begin when Taiwan Semiconductor Manufacturing Company (TMSC) chip producer mass produce 7 nm or even 5 nm as it is stated in 9TO5MAC’s site.
In Foundry Forum, Samsung claimed to produce the 5 nm chip design and 4 nm chip design in 2019 and 2020. This early year, Samsung announced to produce 7 nm process technology chip for Snapdragon 855, Qualcomm. The chipset is expected to be Samsung S10’s new weapon next year.
PHONE ARENA | 9TO5MAC
